In the processing requirements, the above-mentioned applications usually require the use of very sophisticated cutting, drilling and grooving processes on these brittle and brittle materials, which makes the traditional milling, grinding and grinding processes Of the challenge, because the material is extremely thin and very brittle, the process of application due to contact with the application of any stress on the material, may lead to material fragmentation, and ultimately scrapped. With the application of these brittle materials in products such as LEDs, smart phones, wearable equipment, etc., the 1000mw laser pointer systems and related research institutions that are working on such brittle materials are also increasing, and their efforts have This kind of brittle materials laser processing technology continues to develop.
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If the laser retroreflective protection capability is not strong enough, even if the high power QBH or QD transport fiber designed to withstand the kilogram of retroreflective peeling off the fiber cladding, the back-emitting laser beam passes through the fiber core of the transfer line Reflected back into the fiber inside the laser. Even technology-leading fiber laser manufacturers have experienced a variety of painful lessons, system integrators have realized that the laser fiber coupler, or laser module will be damaged.
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While the market is demanding high demand from the market to reduce processing steps, reduce material waste and dry process and other factors continue to drive, is also a strong impetus to the laser manufacturers and laser system integrators to provide continuous discussion, asking them not only to provide Traditional mechanical processing alternatives, but also continue to enhance the overall performance of 3000mw laser pointer processing solutions to the processing quality, product yield, processing speed and mass production has been a breakthrough.

Laser as an advanced processing tool, has more and more widely in the industrial production plays a pivotal role. With the continuous development of laser technology, its by virtue of the processing quality, processing complexity, processing efficiency and clean environmental protection and other advantages, not only in the stainless steel, copper, alloy and other metal materials processing favored, but also in the glass , Ceramics, sapphire, semiconductor silicon wafer, PCB board and other non-metallic materials processing highlights a unique advantage.
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The new CF series lasers already incorporate advanced back-to-back reflection technology and a well-dispersed, retroreflective laser, stripping off the back-reflecting laser beam and providing safe consumption at the critical point of the 4000mw laser pointer by proprietary pattern stripping Scattered interference light. This sophisticated retro-reflective technology has been tested and its robustness has been proven to be more sensitive to back-reflecting lasers in kilowatt-class fiber amplifiers. The combination of these retroreflective protection schemes in the new CF series fiber lasers verifies its unparalleled performance in cutting and welding a wide variety of highly reflective metal materials with a thickness ranging from